1. DESCRIPTION
NHN Nomex Paper/Polyimide Film Composite is Laminates of 2 layers of Nomex paper bonded to one layer of polyimide film。
2. FEATURES
Thermal class H (180°C)
Excellent machinability
Excellent dielectric properties and mechanical strength
Very good absorption of impregnation and trickle resins
3. APPLICATIONS
Used as primary insulation for Class H applications in the electrical industry, in particular as slot insulation, phase barrier and interturn insulation for motors and transformers.
4. TECHNICAL PARAMETER
|
Item |
Unit |
Normal value |
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|
Normal thickness |
mm |
0.15 |
0.17 |
0.20 |
0.23 |
0.25 |
0.30 |
0.33 |
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|
Thickness tolerance |
mm |
±0.020 |
±0.020 |
±0.030 |
±0.030 |
±0.040 |
±0.040 |
±0.050 |
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|
Grammage |
G/m2 |
155±25 |
175±25 |
195±30 |
230±35 |
260±40 |
300±45 |
330±50 |
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|
Tensile strength |
MD |
No bending |
N/10mm |
≥120 ≥70 |
≥140 ≥90 |
≥160 ≥90 |
≥180 ≥130 |
≥200 ≥150 |
≥250 ≥170 |
≥270 ≥180 |
|
|
After bending |
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|
TD |
No bending |
≥80 ≥50 |
≥90 ≥70 |
≥100 ≥80 |
≥110 ≥80 |
≥120 ≥100 |
≥150 ≥110 |
≥170 ≥130 |
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|
After bending |
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|
Elongation |
MD |
% |
≥10 ≥8 |
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|
TD |
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|
Breakdown voltage |
No bending |
kv |
≥8 ≥7 |
≥9 ≥8 |
≥10 ≥9 |
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|
After bonding |
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|
Bond strength at room temp. |
No delamination |
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|
Bond strength at heat temp. (200±2℃) 10min |
No delamination, no blister, no adhesive flow |
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