Features:

Excellent performance of moisture proof, salt spays proof and fungus proof;

Excellent high frequency performance;

Excellent thermal conductivity;

Thermal expansion coefficient close to silicon, has good dimensional stability

Application:

High-power integrated circuit module;

Electronic power modules;

Smart power modules;

High-frequency and high –power switching power supply;

Antomotive electronics components etc.

Specification:

Base thickness: 0.635mm, 1.0mm

Copper: 0.005mm-0.2mm

Size: 114*114mm, 114*165mm